Toray Flip chip Bonder, FC 3500 NS

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Seller: semiautotek (35) 0%, Location: Seoul, default, Ships to: Free Local Pickup, Item: 192000008939 FeaturesOptimal system integration based on bonding process that the customer requires.A short cycle time of 1.7 sec/chip is attainable in combination with the high alignment accuracy of ± 2 µm, by moving search function and highly stiff frame structure.The system is exchangeable among ultrasonic bonding process, thermo-compression process, and Solder process, by a simple change-over. (Head change-over time: about 15 minutes)It is possible to set a variety of temperature and pressure profiles, with the unique ceramic heater and pressure control method.Fine pitch and high precision interconnection is possible at relatively low temperatures for a package with multiple bumps, by the unique DSS (Dual Support System) structure of its ultrasonic bonding head.SpecificationsSubstrate size [mm]80L × 40W-250L × 80W t=0.2-1Substrate typesGlass Epoxy, FPC, Ceramics, etc.Chip size [mm]Thermo-compression process *13L × 3W-20L × 20W t=0.05-1Ultrasonic bonding process *23L × 3W-15L × 15W t=0.3-0.8Ultra low pressure bonding process3L × 3W-10L × 10W t=0.05-1Number of chip typesWafer : 1, Waffle tray : Max 3Chip orientation *3Face up (Wafer 6”, 8”, 12” or Waffle tray 2”, 3”, 4”)Cycle time *41.7 [sec/chip]Alignment accuracy (3σ) *5±2 [µm] (X, Y)Bounding force [N]High-stiffness head4.9-490Ultra low pressure head0.049-19.8Bonding head typeUltrasonic head50kHz, 150W temperature RT, 100 [°C] , 150 [°C] , 180 [°C] , 200 [°C]Ceramic heater headtemperature RT-450 [°C]Power3-phase, AC200V ±10%, 50/60Hz ±1Hz or 3-phase, AC220V ±10%, 50/60Hz ±1Hz, 10kVAAir pressure [MPa]Dry air 0.49Vacuum [kPa]-80Equipment dimensions [mm]Approx. 1730W × 1420D × 1600H (Dimensions of substrate loading / unloading unit are not included)Weight [kg]Approx. 2200 (Weights of substrate loading / unloading unit are not included)Standard functionHigh-stiffness headZ-axis controlAutomatic thermo-calibrationAutomatic coplanarity adjustmentData logger Notes *1 Slim chip (Min. 1.0mm Wide) and large-sized chip (Max. 30.0mm Long × 30.0mm wide) can be processed with an optional heat tool. *2 Slim chip (Min. 1.0mm Wide) and long chip (Max. 28.0mm Long × 10.0mm wide) can be processed with an optional horn. *3 12" wafer and waffle tray can be processed with options. *4 Cycle time dose not include processing time (i.e. loading, bonding and vacuum release). *5 Accuracy measurement is taken using Tray-standard substrates.Process The system is exchangeable among ultrasonic bonding process, thermo-compression process and solder process, by a simple change-over. OptionsGlass backup stageVacuum pumpIonizerWafer mappingPre-heat & post-heat stageCeramic heat stage (20 × 20mm)N2 PurgeMain bonding unitDispenser unitConstant temperature oven for substrate Condition: Seller refurbished, Condition: Excellent condition.Full option, MPN: Does Not Apply, Country/Region of Manufacture: Japan, Brand: Toray, Model: FC3500NS, Bundle Listing: No

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