Location:Morgan Hill, California,
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Item:201545782305Model: Matrix 105 semiconductor process equipment Original Equipment Manufacturer:MatrixCondition: Refurbished by seller Wafer Size: 2 to 6 inch capability configuration. Process Gasses: O2 and N2Valid Time: Subject to prior saleLead Time: 8 weeksLocation: Silicon Valley, CA, U.S.A.Warranty: 6 months non-consumable parts, EX-WORKs. Customer is responsible for shippingInstallation and training: Available at extra charge all over the world.Service Contract: Available at extra chargeMatrix 105 plasma Asher Plasma descum semiconductor equipment General Description only for reference.The Matrix 105 plasma Asher Plasma descum semiconductor equipment represents the Industry Standard in single-wafer photoresist removal and the mainstay of the highly successful System One family. Developed in cooperation with many of the world’s leading IC producers, the Matrix 105 plasma Asher Plasma descum semiconductor equipment has been designed for optimum performance and Cost of Ownership. The Model 105 provides high throughput in a single wafer system capable of handling wide variety of substrates, including round or square, and ranging from 50mm up to 150mm. By maintaining independent closed-loop system controls, the system optimizes vital device parameters:• Enhanced gate oxide integrity • Reduced threshold and capacitance voltage shifts • Reduced contact resistance/ oxidation.These benefits are coupled with exceptional reliability proven in more than 700 System One installations worldwide.The Matrix Model 105 is available free-standing (as shown here) or in a through-the-wall configuration.Matrix 105 plasma Asher Plasma descum semiconductor equipment Applications Photoresist Stripping• High dose implant (As+, B+, P+) • Post-polysilicon etch • Post-metal etch • Post-oxide etch • ReworkControlled Resist Removal• Post-develop descum (pre-etch) • Dry/wet process capability • Uniformity capability (35 WPH on 150mm substrates (60 second process time)Aluminum Wafer Chuck Provides Fast, Precise, Uniform Removal of Resist Low Particles 0.3μm) added per cm2 Proven System Performance >700 System Ones in use worldwide, >95% uptime Proven Reactor Design Optically dense and mechanically robust quartz baffle assembly provides separation of wafer from plasma for true “downstream” performance, with maximum gate oxide protection Closed-Loop Temperature Control Resistively heated wafer chuck, stable range for strip: 150°C – 250ºC (+/-5°C), for descum: 70°C – 150ºC (+/-5°C), provides precise temperature control and reduces thermal degradation and electrical damage. Photocell Endpoint Automatic endpoint detection for optimizing throughput. Pick-and-Place Wafer Handling Brooks Orbitran® system, cassette to cassette wafer handling Production Oriented Easy to learn, one-button operation Process recipe stored on magnetic card System Diagnostics/Modularity Maintenance is quick and simple Small Footprint Only 25” W x 28” D (63.5cm x 71cm)Condition:Seller refurbished, Condition:Please contact us by firstname.lastname@example.org if necessary. It was working except description. We did not test it. We sell it at AS IS without warranty/refund except description., Model:Matrix 105, Country/Region of Manufacture:United States, MPN:System One
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Matrix 105 System One Stripper Plasma Asher Plasma descum Dry Asher Dry Etch